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Thermomechanical Stress of Lead Free Solder Joint
Libich, Jiří ; Šandera, Josef (referee) ; Starý, Jiří (advisor)
This diploma thesis deals with the reliability of lead-free solder joints at a different interconnection structures. The first goal is to design the test cases shape BGA (FC) for testing the strength of lead-free solder joints at shear test in link with design of measuring method to detection shear strength during isothermal aging of lead-free solder joints. Following this shear stressing is investigating influence material and process compatibility, ie. pads finishing, material of solder and integrate of temperature (this mean thermal energy supplied during soldering) to lead-free solder joint strength.
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Lead Free Solder Joint Strength and Cooling Gradiient Influence
Vítek, Jiří ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The object of this work is to monitor the impact of gradient cooling on the strength of the solder joint and its crystalic structure. Dummy packages BGA4 were soldered on PCBs with test structure. Base material FR4, Cu interconnections were protected with OSP and Ni – Au surface finishes and SAC405 solder was used. The samples were made in three different cooling gradients, 6.80 °C/s, 2.00 °C/s and 0.16 °C/s. The bond strength was measured by using the shear strength test on device DAGE PC 2400. Realised microsections were studied on an optical microscope OLYMPUS GX 51.
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Lead Free Solder Joint Strength and Cooling Gradiient Influence
Vítek, Jiří ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The object of this work is to monitor the impact of gradient cooling on the strength of the solder joint and its crystalic structure. Dummy packages BGA4 were soldered on PCBs with test structure. Base material FR4, Cu interconnections were protected with OSP and Ni – Au surface finishes and SAC405 solder was used. The samples were made in three different cooling gradients, 6.80 °C/s, 2.00 °C/s and 0.16 °C/s. The bond strength was measured by using the shear strength test on device DAGE PC 2400. Realised microsections were studied on an optical microscope OLYMPUS GX 51.
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Thermomechanical Stress of Lead Free Solder Joint
Libich, Jiří ; Šandera, Josef (referee) ; Starý, Jiří (advisor)
This diploma thesis deals with the reliability of lead-free solder joints at a different interconnection structures. The first goal is to design the test cases shape BGA (FC) for testing the strength of lead-free solder joints at shear test in link with design of measuring method to detection shear strength during isothermal aging of lead-free solder joints. Following this shear stressing is investigating influence material and process compatibility, ie. pads finishing, material of solder and integrate of temperature (this mean thermal energy supplied during soldering) to lead-free solder joint strength.
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